Another Snapdragon Chipset in the Works, Codenamed as Hana v1.0

The South Korean giant has recently launched the Galaxy S8, S8 Plus and Galaxy Note 8 smartphones have packed with Qualcomm Snapdragon 835 SoC. The rumored mill is suggesting that Qualcomm Snapdragon 845 chipset would be planning to bring their upcoming smartphones on Samsung Galaxy S9 and Galaxy S9 Plus, which would be expected to launch at MWC 2018. Now, it has leaked another information that is Qualcomm company is working on next chipset with a codenamed as Hana V1.0, which has been leaked via reliable leakster Roland Quandt.

The next chipset model would be expected as Qualcomm Snapdragon 855 which would be working on 7nm architecture, while Snapdragon 845 chipset has a codenamed as Napali v2.0, which is working on 10nm technology. The leakster has mentioned the references in the Linkedin profile of George Fang, who is a software engineer. Google is manufacturing the L Linux kernel driver, which is working for upcoming chipsets of Qualcomm Snapdragon 845 & Snapdragon 855 SoC. The Qualcomm Snapdragon 855 SoC is expected to bring on Samsung S series and Note series smartphone in 2019.

The Snapdragon 855 chipset would provide 30 to 40 percent of better performance than Snapdragon 845 SoC and also bring several improvements like AI capabilities and power efficiency. Also, this chipset would be expected to offer an ultrasonic fingerprint sensor which would be embedded under the display. This feature has been leaking for a couple of months onwards for the upcoming Samsung smartphone which would happen in 2019. The Snapdragon 845 chipset would be announced in the year of 2018, which would happen in the first quarter or second quarter and is expected to be announced in the fourth quarter of 2018.

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