LG, who is using Qualcomm Snapdragon 810 chipset on its upcoming G Flex 2, denied any overheating problems with Qualcomm Inc’s new Snapdragon processor. LG’s Woo said on Thursday that internal tests for the G Flex2, powered by the new Qualcomm processor, show that the new product emits less heat than other existing devices. The new phone is scheduled to start selling in South Korea on Jan. 30.
“I am very much aware of the various concerns in the market about the (Snapdragon) 810, but the chip’s performance is quite satisfactory,” Woo Ram-chan, LG vice president for mobile product planning, told reporters at a press event for the company’s G Flex2 smartphone.
Earlier this week, Bloomberg reported that Samsung Electronics Co Ltd, the world’s top smartphone maker, decided not to use the new Qualcomm processor for the next flagship Galaxy S smartphone after the chip overheated during testing. Samsung and Qualcomm have declined to comment on the report, which cited unidentified sources.
Over last few months, several reports have pointed to issues with the Snapdragon 810 chipset related to overheating – potentially delaying many flagship handsets. A more recent report also indicated Samsung would initially only release the Galaxy S6 with its own Exynos processor, before releasing the Qualcomm-variant in limited quantities.
