Earlier, there were rumors that Xiaomi’s Mi5 will be the first smartphone to feature the latest Snapdragon 820 processor, and the recent rumors suggested that the Samsung Galaxy S7 will be the first device to power Snapdragon 820 chipset. At CES 2016 event Qualcomm cleared all the doubts by unveiling LeTV Le Max Pro that will be the first smartphone to come powered by Snapdragon 820 quad-core processor.
The LeTV Le Max Pro will also be the first device to feature Qualcomm Sense ID fingerprint technology that can offer more security to the smartphones. The Ultrasonic-based Sense ID can also detect whether it is a live finger or not and can provide more accurate results. The smartphone will also come with latest 802.11ad multi-gigabit Wi-Fi and X12 LTE with Cat 12/13 supporting download speeds upto 600Mbps.
Le Max Pro is the successor of Le Max that launched last year in April. The rumored specifications of the device are it will flaunt a 6.33-inch (2560×1440 pixels) 2K display with latest Corning Gorilla Glass protection on top of it. The smartphone will come with 4GB RAM, 32GB/64GB/128GB of built-in storage and also supports microSD card slot for further expansion. It supports dual sim dual standby and will run on latest Android 6.0 Marshmallow out of the box.
On the photographic section, the device will sport a 21MP rear camera with OIS dual LED flash and an Ultrapixel front-facing shooter for selfie lovers. Connectivity options on the handset include 4G-LTE, Wi-Fi, GPS/A-GPS, Bluetooth 4.2, NFC and USB Type-C port. The handset will come backed by a 3400mAh battery and will also support Quick Charge 2.0. Apart from the Snapdragon 820 chipset, no other details about Le Max Pro smartphone are confirmed by the company. The smartphone is expected to be available in the first half of 2016. Stay tuned for official details, pricing and availability of the smartphone in coming days.
